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Buy Li-ion Battery 18650
Single-Sided PCB | Double-Sided PCB | Multilayer PCB | Flexible PCB(FPC)

Multilayer PCB Manufacturer

Multilayer PCB Highlights(4~8 Day QTA sample,10~15 Day Mass production first lot.)

Multilayer PCB(4 Layers)

Power Module Material：Ceramic+FR-4+Copper base Layer Coverage：4 Layers+Copper base Surface Technique：Immersion Gold Specialty：Ceramic+FR-4 Multiply materials copper-clad laminate.
Multilayer PCB(6 Layers)

O-E Module Material： Ceramic+FR-4 Layer Coverage：6 Layers Thickness：1.0 mm Surface Technique：Gold-plate +finger Specialty：Embedded Orientation
Multilayer PCB(8 Layers)

Embedded Systems Material：FR-4 Layer Coverage：8 Layers Thickness：1.6 mm Surface Technique：HAL Line Width/Space：4mils/4mils Solder Mask Colour：Yellow.

Multilayer PCB(10 Layers)

DC/DC Power Module Material：Hi-Tg (170℃)、FR-4 Layer Coverage：10 Layers Thickness：1.6 mm Surface Technique：Immersion Gold Specialty：Copper Weight 105 um Blind-via/Buried-via Larger Current.
Multilayer PCB(8 Layers)

Telecommunication base-station Material：FR-4 Layer Coverage：8 Layers Thickness：2.0 mm Surface Technique：HAL Line Width/Space：4mils/4mils Specialty：BGA、Impedance Control、Shade Solder.
Multilayer PCB(6 Layers)

Data Collect Material：FR-4 Layer Coverage：6 Layers Thickness：1.6 mm Surface：Electrolytic Au + Finger Au Weight Of Finger：30 Microinch Solder Mask Colour：blueBlind-via .
Single-Sided PCB | Double-Sided PCB | Multilayer PCB | Flexible PCB(FPC)
Detailed Account of Multilayer PCB
  • Power Module Material：Ceramic+FR-4+Copper base Layer Coverage：4 Layers+Copper base Surface Technique：Immersion Gold Specialty：Ceramic+FR-4 Multiply materials copper-clad laminate.
  • O-E Module Material： Ceramic+FR-4 Layer Coverage：6 Layers Thickness：1.0 mm Surface Technique：Gold-plate +finger Specialty：Embedded Orientation.
  • Embedded Systems Material：FR-4 Layer Coverage：8 Layers Thickness：1.6 mm Surface Technique：HAL Line Width/Space：4mils/4mils Solder Mask Colour：Yellow.
  • DC/DC Power Module Material：Hi-Tg (170℃)、FR-4 Layer Coverage：10 Layers Thickness：1.6 mm Surface Technique：Immersion Gold Specialty：Copper Weight 105 um Blind-via/Buried-via Larger Current .
  • Telecommunication base-station Material：FR-4 Layer Coverage：8 Layers Thickness：2.0 mm Surface Technique：HAL Line Width/Space：4mils/4mils Specialty：BGA、Impedance Control、Shade Solder.
  • Data Collect Material：FR-4 Layer Coverage：6 Layers Thickness：1.6 mm Surface：Electrolytic Au + Finger Au Weight Of Finger：30 Microinch Solder Mask Colour：blueBlind-via.

    • China Multilayer PCB Manufacturer and Multilayer PCB Supplier
    Single-Sided PCB | Double-Sided PCB | Multilayer PCB | Flexible PCB(FPC)
    ( Tel: +86-769-87086168Ext.8009  Fax: +86-769-87086068   *  Email: 
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